In order to determine the problem I like to know do you sputter the materials or E beam, and are you confident the PR does not exceed the temp were lift of becomes problematic. Walter@elume.com ----- Original Message ----- From: "Kevin R. Anglin"To: Sent: Monday, November 30, 2009 2:51 PM Subject: [mems-talk] Problems with EOT Liftoff of 1.5 um diameter holes (Auon GaAs) >I can't get good EOT liftoff for 1.5 um diameter hole arrays. > > I'm using PR5214 spun 1.1 um thick, then deposit 50/1000 Angstroms > of Ti/Au. I use a supersonic acetone bath to liftoff, but it doesn't. I've > tried Chlorobenzene dips post-expose pre-develop, as well as varying > baking > times and exposure times. Sometimes I liftoff donut shaped patterns > instead > of holes. > > Any suggestions would be welcomed, as I continually waste gold.