Hi Gareth

I intend to use a different mask for the 15um layer. Do you mean I
should spin, pre-bake, expose, PEB as per spec for the 1st 30um  layer
and then spin, pre-bake, expose, PEB 15um 2nd layer as per spec before
developing the 45um thick 2 layers?

thanks a lot

-AJ

On Tue, Oct 26, 2010 at 3:21 PM, Gareth Jenkins  wrote:
> This is possible. Just process each layer using the softbake and PEB
> parameters for the appropriate thickness single layers (i.e. 30 micron then
> 15 micron). Expose the second layer taking into account the increased
> thickness and develop in one final step.
>
> One thing. I'm not sure of is what effect the different solvent system used
> between the 2000 & 3000 series. It may be safer to stick to the same series.
>
>  On 26 Oct 2010 19:47, "Abhishek Jain"  wrote:
>> Hi
>>
>> I am wondering if someone in this community has prepared SU8
>> lithography wafers in 2 layers.
>>
>> I am attempting to make a 30um high layer of patterns (SU8-2025) over
>> which I want to make another 15um (SU8-3010) high features.
>>
>> In particular, it will be most helpfull to know what adjustments I
>> should make in baking temps, time and exposure dose, times on both
>> layers, if there is any need for that.
>>
>> Thank you very much
>>
>> Abhishek Jain

--
Abhishek Jain
Steele Lab for Tumor Biology
Harvard Medical School
Massachusetts General Hospital
149 13th Street
Charlestown MA 02129

PhD Candidate
Biomedical Engineering
Boston University
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Boston, MA 02114

Phone: 617-726-4089(work)