The project I am working on involves through wafer etching with a DRIE
machine. I am interested to see how this is done in other facilities.
My current process involves attaching a patterned piece of silicon to
another 4" wafer (the only size our STS will accept). I tried spinning
a thick coat of photoresist on the carrier wafer and exposing an area
in the middle for my sample (so that I would have better thermal
contact to the sample. I use cool grease to attach the sample to the
carrier wafer.) and that seemed to work ok, but there must be a better
way.

Any ideas?


Jonathan Abbott
jdabbott@byu.net