I'm using the same method. The machine by STS can reach a very good selectivity to PR, say 150. So I don't think you need to spin thick resist on your wafer. By the way, does anybody have some information on conductive polymer, which contains NO metal? Thanks a lot! BR > From: forzaabbott@gmail.com > To: mems-talk@memsnet.org > Date: Tue, 9 Nov 2010 10:27:39 -0700 > Subject: [mems-talk] Through wafer DRIE etching > > The project I am working on involves through wafer etching with a DRIE > machine. I am interested to see how this is done in other facilities. > My current process involves attaching a patterned piece of silicon to > another 4" wafer (the only size our STS will accept). I tried spinning > a thick coat of photoresist on the carrier wafer and exposing an area > in the middle for my sample (so that I would have better thermal > contact to the sample. I use cool grease to attach the sample to the > carrier wafer.) and that seemed to work ok, but there must be a better > way. > > Any ideas? > > > Jonathan Abbott > jdabbott@byu.net