durusmail: mems-talk: Issues with footing in thin SU8
Issues with footing in thin SU8
2012-09-13
2012-09-13
2012-09-14
2012-09-16
2012-09-16
Issues with footing in thin SU8
Daniel Figura
2012-09-13
Hello Diane,



Some ideas:

1) do you have transparent layers under your SU-8? Glass substarte, thick
oxide, ... -  the footing can be caused by back reflection from layers
underneath. It will be worse close to larger structures

2) are you sure that it is no caused by diffraction from the mask - do you
have good contact or controlled proximity during exposure? What is your mask
aligner?

3) Is your SU-8 sufficiently cross-linked? Sometimes what can happen is that
if your resist is not cross-linked enough, you are slowly dissolving some of
it during development step and during rinsing and drying you deposit the
residues along the structures. If you compare the thickness of your layer
before and after development and do not see significant thickness loss you
can discriminate this.





With best regards,



Daniel







Daniel Figura



smartfabgroupT Company



process consulting . data processing . fab software



Phone: +421 944 45 26 86



E-mail: daniel.figura@smartfabgroup.com, Web: www.smartfabgroup.com







Disclaimer notice: The information contained in this message and any
attachments is intended only for the personal and confidential use of the
designated recipient(s) named above. If you are not the intended recipient
of this message you are hereby notified that any review, disseminitation,
distribution or copying of this message is strictly prohibited. If you have
received this message by error, please notify the sender immediately.







-----Original Message-----
From: mems-talk-bounces+daniel.figura=smartfabgroup.com@memsnet.org
[mailto:mems-talk-bounces+daniel.figura=smartfabgroup.com@memsnet.org] On
Behalf Of Diane Atkinson
Sent: Thursday, September 13, 2012 14:04
To: mems-talk@memsnet.org
Subject: [mems-talk] Issues with footing in thin SU8



Hello,

       I am trying to process 4um of SU8 3005,and am having issues with the
footing at the bottom of my pattern, I t is about 1-1.5 microns. I have
tried several things and nothing seem to fix this problem, I am about to try
CEM, but am wondering if there is an alternative way to prevent this ,maybe
reduce the PEB ?  Thank you



Also,I tried to send this once but I am not sure if it went so I am
resending-

_______________________________________________

Hosted by the MEMS and Nanotechnology Exchange, the country's leading

provider of MEMS and Nanotechnology design and fabrication services.

Visit us at http://www.mems-exchange.org



Want to advertise to this community?  See http://www.memsnet.org



To unsubscribe:

http://mail.mems-exchange.org/mailman/listinfo/mems-talk

_______________________________________________
Hosted by the MEMS and Nanotechnology Exchange, the country's leading
provider of MEMS and Nanotechnology design and fabrication services.
Visit us at http://www.mems-exchange.org

Want to advertise to this community?  See http://www.memsnet.org

To unsubscribe:
http://mail.mems-exchange.org/mailman/listinfo/mems-talk
reply