Good afternoon Hong,

Could you elaborate more on your process?

Which type of bonding technique you are using?

How does the substrate break, e.g. mechanical, thermal, or else?

We, EV Group, have extensive experience on wafer bonding, thin wafer handling,
and temporary bonding followed with debonding.   We will be happy to help at our
applications lab in Tempe, Arizona.


Best Regards,
Tian Tang

EV Group
invent * innovate * implement
Applications Engineer - Direct: +1 (480) 305 2455, Main: +1 (480) 305 2400 Fax:
+1 (480) 305 2401
Cell: +1 (480) 274 3892
E-Mail: T.Tang@EVGroup.com
Web: www.EVGroup.com

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