> We start working on lithography and bonding process using 170 um thin > fused silica for microfluidic devices. We always got broken wafers. > We are looking for materials and techniques for supporting the thin wafer. > The support wafer should be easily removed after the device is assembled. Dear Hong, Suss MicroTec (www.suss.com) offers a large spectrum of temporary wafer bonding processes and equipment, from lab to fab scale. Check our website, or contact me off-list, and I will get you in contact with our local organization. -- Klaus BeschornerSuss MicroTec Bonder Products Technical and Application Support _______________________________________________ Hosted by the MEMS and Nanotechnology Exchange, the country's leading provider of MEMS and Nanotechnology design and fabrication services. Visit us at http://www.mems-exchange.org Want to advertise to this community? See http://www.memsnet.org To unsubscribe: http://mail.mems-exchange.org/mailman/listinfo/mems-talk