Dear Hong, if you look for simple lab equipment you can get it from idonus in Switzerland ( www.idonus.com ). Their specialties are custom made solutions. Best regards Christian On 22.05.2013 20:55, Hong Wang wrote: > Dear All, > We start working on lithography and bonding process using 170 um thin > fused silica for microfluidic devices. We always got broken wafers. > We are looking for materials and techniques for supporting the thin wafer. > The support wafer should be easily removed after the device is assembled. > Any input will be appreciated. > Hong > _______________________________________________ > Hosted by the MEMS and Nanotechnology Exchange, the country's leading > provider of MEMS and Nanotechnology design and fabrication services. > Visit us at http://www.mems-exchange.org > > Want to advertise to this community? See http://www.memsnet.org > > To unsubscribe: > http://mail.mems-exchange.org/mailman/listinfo/mems-talk > _______________________________________________ Hosted by the MEMS and Nanotechnology Exchange, the country's leading provider of MEMS and Nanotechnology design and fabrication services. Visit us at http://www.mems-exchange.org Want to advertise to this community? See http://www.memsnet.org To unsubscribe: http://mail.mems-exchange.org/mailman/listinfo/mems-talk