Hi Ricky,

can you provide some more detailed information about your developers and Cu film
as well as the substrate and adhesion layer if any?
________________________________________
From: mems-talk-bounces+nsy25c=mail.missouri.edu@memsnet.org [mems-talk-
bounces+nsy25c=mail.missouri.edu@memsnet.org] on behalf of Ricky Anthony
[ricky.anthony@tyndall.ie]
Sent: Monday, September 30, 2013 5:37 AM
To: mems-talk@memsnet.org
Subject: [mems-talk] TMAH reaction with copper

Hi All,

I am working with Metal Ion free developers (MIF). I find that some TMAH based
MIF developers react with copper to form complex, while others do not even
though they are TMAH MIF based. What could be the possible explanation behind
this?

Many Thanks,

Ricky Anthony

Microsystems Center
Tyndall National Institute
University College Cork
Cork, IRELAND

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