Hi Ricky,



sorry for my late answer, I was out for holidays. We experienced that the
time between the process steps should be as short as possible, especially
with layers like copper which can be easily oxidized. A variation in the
time flow makes a difference in the performance, for e.g. in the degree of
oxidation. Furthermore it is possible that some manufacturers use inhibitors
against the attack of copper in their developer formulations. I was
searching for such inhibitors for etching solutions and I found several
patents on this issue.



Best regards/Mit freundlichem Gruß



André Bödecker



IMSAS

Institut für Mikrosensoren, -aktoren und -systeme

Universität Bremen Fachbereich 1

Otto-Hahn-Allee1

28359 Bremen

Tel: 0421 218 62596



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