Dear mems-talk community, Question about anodic wafer bonding of "silicon to aluminum oxide coated borosilicate glass (Pyrex)" We are planning to wafer bond silicon wafer surface to borosilicate glass substrate surface via anodic bonding. It seems that this is well known, and documented. Although it is well known, this may bring some complications to our integration process flow. Because of these complications, we are looking for alternative approaches that may be tried to reduce the complications in the integration process. An idea that we have that will reduce some process steps and complications is below: Our integration process directs us to think about wafer bonding of silicon substrate to 15nm aluminum oxide coated borosilicate glass (Pyrex). In case you wonder, 15nm aluminum oxide is ALD (Atomic layer Deposition) coated on Pyrex. We wonder if anyone of you have any experience with wafer bonding of silicon substrate to aluminum oxide coated borosilicate glass (Pyrex), or a similar material stack? If you do not have direct experience, comments based on your anodic wafer bonding experience are also very welcome. Regards, and thanks in advance, Mehmet Yilmaz Mechanical Engineer _______________________________________________ Hosted by the MEMS and Nanotechnology Exchange, the country's leading provider of MEMS and Nanotechnology design and fabrication services. Visit us at http://www.mems-exchange.org Want to advertise to this community? See http://www.memsnet.org To unsubscribe: http://mail.mems-exchange.org/mailman/listinfo/mems-talk