durusmail: mems-talk: Using DAD3220 Dicing Saw without water and air flow
Using DAD3220 Dicing Saw without water and air flow
2016-06-20
Using DAD3220 Dicing Saw without water and air flow
2016-06-20
2016-06-20
2016-06-21
2016-06-21
2016-06-21
Using DAD3220 Dicing Saw without water and air flow
Mehmet Yilmaz
2016-06-21
Dear Ricky Anthony, Yongliang, Rick Morrison, and Horacio,
Thanks for taking the time to answer my question.
I will definitely consider, and take into account your answers.

I will post another reply once I have a solid solution to the problem that
I have.

Sincerely,

Mehmet

On Mon, Jun 20, 2016 at 10:12 PM, HORACIO ESTRADA VAZQUEZ <
horacio.estrada@cidesi.edu.mx> wrote:

> I think laser dicing is the best scenario for the application/situation
> that you are entretaining.
> Not difficult to implement!
>
> Best regards,
>
> HE
>
> *             _______*
>
> *Horacio V. Estrada, PhD*
> Director
> Laboratorio de Microsistemas
> CIDESI
> Queretaro, QRO
> Phone: +52 (442) 211-9800 x1511
> Cell MEX: +52 (442) 471-4179,
> Cell USA: +1 (980) 254-6951
> ________________________
>
> 2016-06-20 2:11 GMT-05:00 Mehmet Yilmaz :
>
> > Dear mems-talk community,
> > We have a standard Si wafer that we would like to dice into smaller 1cm x
> > 1cm square pieces.
> >
> > The challenge is below:
> > 1. We have very delicate structures on the Si wafer. So, we cannot flow
> > *strong* air and/or water on Si wafer while dicing. The *strong* flow of
> > air/wafer damages the delicate structures.* Here, it is very important to
> > emphasize that, the main contributors to the damage are strong water flow
> > and/or strong air flow.*
> >
> > As part of the solution,
> > We can sacrifice a blade of a dicing saw (~30 USD), and just try to dice
> > the wafer without water/air flow. However, we are concerned that we may
> be
> > damaging more than just the blade of the dicing saw when we do not let
> > air/water flow during dicing. In case you wonder, the dicing saw is from
> > DISCO, and the type is DAD3220.
> >
> > Also,
> > We may try spinning photoresist on the wafer to protect the delicate
> > structures, but we are reluctant about spinning photoresist as well, due
> to
> > some requirements on the final structures.
> >
> > Any comments from you who might have had this or similar experience in
> the
> > past or currently, would really be appreciated.
> >
> > Thanks in advance.
> >
> > Regards,
> >
> > Mehmet Yilmaz
> > Mechanical Engineer
> > _______________________________________________
> > Hosted by the MEMS and Nanotechnology Exchange, the country's leading
> > provider of MEMS and Nanotechnology design and fabrication services.
> > Visit us at http://www.mems-exchange.org
> >
> > Want to advertise to this community?  See http://www.memsnet.org
> >
> > To unsubscribe:
> > http://mail.mems-exchange.org/mailman/listinfo/mems-talk
> >
> _______________________________________________
> Hosted by the MEMS and Nanotechnology Exchange, the country's leading
> provider of MEMS and Nanotechnology design and fabrication services.
> Visit us at http://www.mems-exchange.org
>
> Want to advertise to this community?  See http://www.memsnet.org
>
> To unsubscribe:
> http://mail.mems-exchange.org/mailman/listinfo/mems-talk
>
_______________________________________________
Hosted by the MEMS and Nanotechnology Exchange, the country's leading
provider of MEMS and Nanotechnology design and fabrication services.
Visit us at http://www.mems-exchange.org

Want to advertise to this community?  See http://www.memsnet.org

To unsubscribe:
http://mail.mems-exchange.org/mailman/listinfo/mems-talk
reply