Ultrasonic Machining would provide excellent results at this size. Please feel free to contact me or visit our WEB site at www.bullen-ultrasonics.com. Mary Bullen Bullen Ultrasonics, Inc. (937)456-7545 Eaton, OH USA -----Original Message----- From: mems-talk-admin@memsnet.org [mailto:mems-talk-admin@memsnet.org] On Behalf Of Roger Brennan Sent: Saturday, February 23, 2002 8:06 AM To: 'mems-talk@memsnet.org' Subject: [mems-talk] Drilling through holes Hi everybody! I'm now wet etching to make through holes in 12 mil (305 microns) <100> Si. The desired hole size is about 10 mils by 30 mils (254 microns by 762 microns). Is laser or physical drilling a possible alternative? How about deep RIE? Thanks. Roger Brennan Home: 1403 Forrestal Avenue San Jose, CA 95110 (408)453-0711 (telephone) (408)573-9407 (fax) rogerbr@earthlink.net Work: Endevco 355 N. Pastoria Ave. Sunnyvale, CA 94085 408-739-3533 ext 204 roger.brennan@endevco.com _______________________________________________ mems-talk@memsnet.org mailing list: to unsubscribe or change your list options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk Hosted by the MEMS Exchange, providers of MEMS processing services. Visit us at http://www.mems-exchange.org/