Hello,

Has anybody had the experience with handling 10-um thin wafer? I want to
deposit Cr/Au layer using E-beam evaporator. I am afraid it will break the
wafer during evaporation due to high temperature and stress. Does anybody
know if it works Ok? And also I think I better bond the thin wafer to
another standard 500um wafer together, but i don't know what kind of
adhesive materials can resist high temperature in E-beam evaporator.

Thanks for your suggestion.

Swiss

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