durusmail
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mems-talk
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Polyimide vs HF (C.Y. Hsieh)
Image of MEMS device and the product in which it is used (Steven F. Nagle)
High frequency capacitance readout (sapple@t2.technion.ac.il)
Rayleigh damping - Si (Aksel Andreas)
Coupling Simulation in ANSYS (Hervé LEBLOND)
Si02 etching recipe (ajain@ecel.ufl.edu)
Other rubber material instead of PDMS inMicrofabrication (Michael D Martin)
Thermal coefficient of expansion on SI vs orientation (Dr. Vincent Choo)
Problems with RF Sputtering of PZT (S. S. Abhishek)