You could try Piranha cleaning too. Quoting "D. Zhou": > Dear all, > > I used S1813 as the mask for the DRIE of the top layer from the front-side. > Then I put the chip upside down, attached it to an Oxide wafer and did > another DRIE of the substrate from the back-side . After the etch, I found > it difficult to remove the polymer formed during the etch. I dip my chips > in Aceton for 10 mins and then used Oxygen plasmer to clean it. However, > the top layer(device layer) of my chips were still not clean enough. Could > anybody give me some suggestions on how to completely clean the chips after > these two DRIE process? Thanks very much. > -- Florian Herrault, PhD student Georgia Institute of Technology 791 Atlantic Dr., Atlanta, GA 30332-0269 ph: 404-894-9909; fax: 404-894-5028