for Bosch polymer, Dupont EKC 270 or CF4 ash will also get it. D. Zhou wrote: > Dear all, > > I used S1813 as the mask for the DRIE of the top layer from the > front-side. Then I put the chip upside down, attached it to an Oxide > wafer and did another DRIE of the substrate from the back-side . After > the etch, I found it difficult to remove the polymer formed during the > etch. I dip my chips in Aceton for 10 mins and then used Oxygen > plasmer to clean it. However, the top layer(device layer) of my chips > were still not clean enough. Could anybody give me some suggestions on > how to completely clean the chips after these two DRIE process? Thanks > very much. >