Are you ramping the temperature down to avoid thermal shocking the
bonded pair?

-----Original Message-----
From: jingru zhang [mailto:ruharvard@gmail.com]
Sent: Thursday, February 26, 2009 11:12 AM
To: mems-talk@memsnet.org
Subject: [mems-talk] glass cracking during anodic bonding

Dear all,

I have deep channels (around a hundred microns) on the silicon
substrate. and
during the anodic bonding of silicon and glass, they bonded well but the
glass cracked. Maybe it is the stress around the channels walls which
caused
cracking. The voltage I am using now is 500 w, and the temperature goes
to
400 deg c.  Does anyone have similar experience? How to avoid this?

Thank you very much.

Best Regards,
Jingru