Try 10nm of Cr as an intermediate layer between Ni and Si. Cheers, Marcel Quoting Salam Gabran: > Hi Guys, > > I am trying to sputter deposit Ni on Si followed by annealing at a different > temperature (350, 450 degreesC). The nickel is 30nm and 200nm. > During annealing, the Ni film peals off, it should be due to thermal > stresses during deposition. > > Any clue how this can be resolved ? > > kind regards > > Salam R. Gabran, MASc. > Research associate, PhD. Candidate > Center for Integrated RF Engineering > (CIRFE) Group > ECE Dept., University of Waterloo