Hi!

Ni has bad adhesion to Cr but good to gold. So, you could try to
sputter first say 15 nm of Cr followed by 80 nm of Gold. And then your
Ni.

Regards,

Denis

2010/9/15  :
> Try 10nm of Cr as an intermediate layer between Ni and Si.
>
> Cheers,
>
> Marcel
>
>
> Quoting Salam Gabran :
>
>> Hi Guys,
>>
>> I am trying to sputter deposit Ni on Si followed by annealing at a different
>> temperature (350, 450 degreesC). The nickel is 30nm and 200nm.
>> During annealing, the Ni film peals off, it should be due to thermal
>> stresses during deposition.
>>
>> Any clue how this can be resolved ?
>>
>> kind regards
>>
>> Salam R. Gabran, MASc.
>> Research associate, PhD. Candidate
>> Center for Integrated RF Engineering
>> (CIRFE) Group
>> ECE Dept., University of Waterloo

--
День

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