Hi all I'm having a problem with the Au/Ti adhesion on glass wafer as follow : I had finished the Au/Ti coating process on the glass wafer (piranha treated), there is no problem. Then I used some of them for my experiment at that time (the adhesion was good) and kept the others for the later use. After a few days when I used the others and there was a problem with the Au/Ti layer. They became sensitive and easily peel off even when washing with DI water. I don't know why there is a different adhesion between the first and the second time using. Does anyone face this problem before ? Thank you Binh Tran MS Candidate - Nano System Kyungwon University - Korea