Thanks for the suggestions. I think I have not made myself quite clear.

I am not releasing Su-8 structures, I am transferring the metal
structures on Si to Su-8.( For example I have wires made of Cr/ Ag or
Cr/ Au sitting on Si wafer. Then i have an layer of Su-8 on top of the
structures. So the metal structures are sandwiched between Su-8 on one
end and Si on the other, the idea is to have the wires transferred on
Su-8 layer).  I had tried different methods for releasing the
structures,like having a Ti or Cr layer covering the entire wafer and
then try to etch away Cr or Ti,but the etchant couldn't go all the way
to the middle of the wires might be because of surface tension. So I had
to resort to etching the whole wafer.

Cheers
A