Hi Alex, Thanks a lot for your reply. I have not yet come up with a plan to do optical lithography about the device, and I will have to use ebeam lithography and bi-layer PMMA for another while. Do you happen to have any successful ALD lift-off experience with PMMA? I have thought of adding another lithography layer to etch the ALD coating and expose the bottom contact to probe. I worried about any HF-based wet etching will take away the adhesion layer of my bottom contact. Also I doubt whether I can find a dry etching tool that allows gold inside (I do most of my processing CNF at Ithaca, NY). Best regards, Josh On Thu, Sep 15, 2011 at 2:19 PM, Alex Mellnikwrote: > If you also do a lift-off process (which is particularly easy if you use a > LOR/S18xx bilayer) then you can just let the bottom electrode extend out > from underneath the ALD layer in one direction. If you don't you can just > etch through the ALD layer on one side of the top electrode... > > -Alex -- Photonics Lab Rochester Inst of Tech Rochester, NY 14623