Hi, group,


I have been trying to do dry etching on Alumina (grown by e-beam evaporation)
with mask of photoresist (OiR908) . Gas agents are BCl3(6) and Ar(14). The
problem is the selectivity is 3:1 PR:Al2O3, which requires extremely thick
resist for targeting ~um thick Alumina etching. Is there any other dry etching
recipe for selective etching alumina over photoresist?

Any help will be highly appreciated.

Best Regards,
Caleb Guo
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