Can you elaborate how you are determining this shrinkage? During softbake there will be loss of solvents and a change in thickness, but it should not cause any stresses because the uncured SU8 should reflow above 65C. Perhaps your ramp rate is too fast causing part of the SU8 to flow while other parts are still solid? On Wed, Oct 22, 2014 at 10:49 PM, KarthiKeyan Kwrote: > Dear All, > > I am facing shrinkage problem on SU8 2075 photoresist layer on Silicon > Substrate. Actually this problem accruing on soft backing process at 65C on > hotplate & hot air oven also. > > Kindly suggest to over come this problem. > > Thanking you, > > Best Regards, > Karthi > _______________________________________________ > Hosted by the MEMS and Nanotechnology Exchange, the country's leading > provider of MEMS and Nanotechnology design and fabrication services. > Visit us at http://www.mems-exchange.org > > Want to advertise to this community? See http://www.memsnet.org > > To unsubscribe: > http://mail.mems-exchange.org/mailman/listinfo/mems-talk > _______________________________________________ Hosted by the MEMS and Nanotechnology Exchange, the country's leading provider of MEMS and Nanotechnology design and fabrication services. Visit us at http://www.mems-exchange.org Want to advertise to this community? See http://www.memsnet.org To unsubscribe: http://mail.mems-exchange.org/mailman/listinfo/mems-talk