>May I know what kind of good conducting metal stuck well to silicon wafer
>and silicon nitride thin film? How about gold? Do we need to put interface
>layer such as cromium etc. to get better adhesion? Thanks a lot.
>
>Best Regards.                                            Sincerely Yours,
>                                                         XueCheng JIN
>============================================================================
>                                XueCheng JIN
>                               --------------
>Phone:   (415) 497-0724 (home)                   Address: 8G Barnes
>Web:     http://www-leland.stanford.edu/~xcjin            Escondido Village
>Email:   xcjin@leland.stanford.edu                        Stanford, CA 94305
>============================================================================
>
>
Answer: If you don't make an HF dip before deposition, you'll always have a
natural oxide layer on Si or Si3N4. Thus, to stick to such a material, you
have to put first a thin (10 to 50 nm ) adhesive layer like Cr or Ti.
If you make the HF dip, Al at least will stick to Si ( usual IC technology
), but about Au or Cu, I can't say!
Hopefully, someone else has the experience!

Best regards,
Pierre Jaccard

__________________________________________________________________
Swiss Federal Institute of Technology (EPFL)
Address:  EPFL, CH-1015 Lausanne, Switzerland
Pierre Jaccard
Phone: +41(21)693 66 38
FAX:    + 41(21)693 66 70
__________________________________________________________________