Hi, We are looking for supplier who can drill more than 1 mm holes on thick
(1 mm) Pyrex glass wafers. Please write to propak@singnet.com.sg Regards.

----- Original Message -----
From: "이태원" 
To: 
Sent: Wednesday, July 02, 2003 11:01 PM
Subject: [mems-talk] Cu Metal Etchant


> hi.
>
> I heard about Cu could be patterned by something like CMP Process (
damascene(?) process)
>
> Are there any wet etchants fot Cu etch? If not, what is the main reason
about that?
>
> Furthermore, Adhesion layer (Ti or Cr) is not required when I deposit Cu
on Si Wafer ?
>
> Thank you for in Advance.
>
> TW Lee.
>
> -----------------------------------------------------------
> AeroMEMS Laboratory.
> School of Mechanical & Aerospace Engineering.
> Seoul National University , Seoul , KOREA.
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