Adhesion layer is definitely needed for Cu thin film on Si wafer. As for
etchants, you could get them on reference book. You may have to adjust the
recipe depending on the specific application.

-----Original Message-----
From: David Nemeth [mailto:nemeth@sophiawireless.com]
Sent: Thursday, July 03, 2003 6:37 AM
To: General MEMS discussion
Subject: RE: [mems-talk] Cu Metal Etchant


Ferric Chloride in water will etch copper.  It's used to make printed
circuit boards.
I strongly suspect an adhesion layer would be necessary for copper on
silicon, but I have no direct experience.

David Nemeth
Senior Engineer
Sophia Wireless, Inc.
14225-C Sullyfield Circle
Chantilly, VA
-----Original Message-----
From: mems-talk-bounces@memsnet.org [mailto:mems-talk-bounces@memsnet.org]On
Behalf Of 이태원
Sent: Wednesday, July 02, 2003 11:01 AM
To: mems-talk@memsnet.org
Subject: [mems-talk] Cu Metal Etchant


hi.

I heard about Cu could be patterned by something like CMP Process
 damascene(?) process)

Are there any wet etchants fot Cu etch? If not, what is the main reason
about that?

Furthermore, Adhesion layer (Ti or Cr) is not required when I deposit Cu on
Si Wafer ?

Thank you for in Advance.

TW Lee.

-----------------------------------------------------------
AeroMEMS Laboratory.
School of Mechanical & Aerospace Engineering.
Seoul National University , Seoul , KOREA.
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