Hi, I am attempting a lift-off technique to pattern gold. I have patterned 7-8um of AZ9260 on SiO2 wafers and evaporated 10nm Chromium followed by 300nm Gold through the patterns in the AZ9260 resist. Subsequently I have lifted off most of the resist by soaking the wafers in Acetone over 2 days. However I have noticed that there are some resist residue that won't be lift-off even after sonication. The sonication process also leaves a lot of debris on the wafer. I am trying to remove these debris and the remaining residue by soaking the wafers overnight in AZ300T Stripper. Does anyone have an alternative technique to suggest to clean the wafers? I have tried using H2SO4:H2O2 = 3:1 (piranha) by it may damage by structures, so I refrain from using this technique. Thanks a bunch! Jeffrey