Jeffrey, I suggest you try using image reversal with AZ5214E photoresist and AZ = developer 1:1 solution. I've had excellent lift off results with 140nm = thick Cr/Au patterns on silicon, down to 3 micron line, 7 micron space. Regards, Thomas E Wilson Professor of Physics Marshall University One John Marshall Drive Huntington, WV 25755-2570 Tel: 304.696.2752 FAX: 304.696.3243 -----Original Message----- From: mems-talk-bounces@memsnet.org on behalf of Yue Mun Pun, Jeffrey Sent: Mon 8/6/2007 5:09 AM To: mems-talk@memsnet.org Subject: [mems-talk] Lift-off process =20 Hi, I am attempting a lift-off technique to pattern gold. I have patterned = 7-8um of AZ9260 on SiO2 wafers and evaporated 10nm Chromium followed by = 300nm Gold through the patterns in the AZ9260 resist. Subsequently I = have lifted off most of the resist by soaking the wafers in Acetone over = 2 days. However I have noticed that there are some resist residue that = won't be lift-off even after sonication. The sonication process also = leaves a lot of debris on the wafer. I am trying to remove these debris and the remaining residue by soaking = the wafers overnight in AZ300T Stripper. Does anyone have an = alternative technique to suggest to clean the wafers? I have tried = using H2SO4:H2O2 =3D 3:1 (piranha) by it may damage by structures, so I = refrain from using this technique.