Hello Jeffrey. Maybe the substrate temperature was too high during metallization process. It should not exceed the usual soft bake temperature for AZ9260, or else at least some resist is not soluble anymore in Acetone or other solvents. If the temperature (hard bake) cannot be avoided, ashing might be the only alternative. Best Regards, Norbert Nodes N.Nodes@EVGroup.com www.EVGroup.com -----Original Message----- From: mems-talk-bounces@memsnet.org [mailto:mems-talk-bounces@memsnet.org] On Behalf Of Yue Mun Pun, Jeffrey Sent: Montag, 06. August 2007 11:09 To: mems-talk@memsnet.org Subject: [mems-talk] Lift-off process Hi, I am attempting a lift-off technique to pattern gold. I have patterned 7-8um of AZ9260 on SiO2 wafers and evaporated 10nm Chromium followed by 300nm Gold through the patterns in the AZ9260 resist. Subsequently I have lifted off most of the resist by soaking the wafers in Acetone over 2 days. However I have noticed that there are some resist residue that won't be lift-off even after sonication. The sonication process also leaves a lot of debris on the wafer. I am trying to remove these debris and the remaining residue by soaking the wafers overnight in AZ300T Stripper. Does anyone have an alternative technique to suggest to clean the wafers? I have tried using H2SO4:H2O2 = 3:1 (piranha) by it may damage by structures, so I refrain from using this technique.