Looks like either there is not enough developer on the wafer or the rinse cycle is not good or both. The rinse water must be applied when the developer is still on. Don't save on rinse time. shay -----Original Message----- From: mems-talk-bounces@memsnet.org [mailto:mems-talk-bounces@memsnet.org] On Behalf Of Sadhana Patil Sent: Friday, October 05, 2007 7:45 PM To: mems-talk@memsnet.org Subject: [mems-talk] fudging/spreading around the PR features I am new to Photolithography. I am doing Photolithography with S1813. Many a times I get fudging/spreading of photoresist around the edge of the photoresist features after developing. They look more or less like threads spreading outward from the feature. Does anyone know what am I doing wrong?