Vinyan:

I typically use Titanium as a seed layer for Platinum (20nm/100nm).
It hasn't given me any problems.

-JP Hilton
Columbia University
BioMEMS Lab

On Mon, Jan 19, 2009 at 10:33 AM, Yinyan Gong  wrote:
> Dear All,
>
> I have a hard time to deposit Chromium (50nm) followed by Platinum (100nm)
> using a e-beam evaporator. After lift-off (using 1165), some areas of the
> metal layer will peel off and the rest part has very rough surface. I note
> that during deposition of Pt, the temperatures is quite high and I have to
> interrupt the deposition when the temperature reaches 90C and let the system
> cool down before depositing again. Any suggestions will be appreciated.
>
> Best regards
>
> Yinyan