Yinyan, It could very well be due to Cr and Pt not having good adhesion to Boron compounds and that is your problem. However, Ti is also a very reactive metal and can act as a getting agent by reacting with compounds so it might be some contamination it is reacting with. HOWEVER, probably you are right and it is just intrinsic to the metal and the boron compound involved. I always like to bring up basic things since they tend to be overlooked. Anyways you will always want to make sure your systems are clean in any case. It can save you much pain. I am glad to hear that you have gotten a good deposition. Ed -----Original Message----- From: mems-talk-bounces@memsnet.org [mailto:mems-talk-bounces@memsnet.org] On Behalf Of Yinyan Gong Sent: Tuesday, January 20, 2009 3:46 AM To: General MEMS discussion Subject: Re: [mems-talk] Deposition of Chromium and Platinum Dear Edward, Thanks for your help. I have deposited Ti followed by Au (sputtering system) on the same substrate and did not have any problem. It seems that the poor adhesion does not due to contamination from cleaning process. I will check whether that is because of system contamination. I am just wondering could that be posssible that Cr or Pt does not have good adhesion to my substrates which are boron compounds and do not have excellent crystalline quality? Thank you very much. Yinyan