Hello, everyone. I use the positive photoresist to do some lithography.
I have a big problem. My samples are rectangular which have dimensions 10mm*15mm
After the resist spinning, I found that the resist film around the edge of the
sapmle is thicker
than the resist in the center. This produces a gap when the contact exposure is
applied.
And the resist profile is not good enough after the development.
I  shall be highly obliged if anyone can help me out in this and provide some
advices.
Thanks in advance

Yours sincerely,

Lei Wang

School of Physics
Shandong University
5, Hongjialou,
Jinan, Shandong Province 250100
P. R. China
Tel:86-531-88364655  Fax: 86-531-88565167
Email: leiwangsdu@sdu.edu.cn