Hello Sandeep,

I had the experience of electro plating Ni using SU-8 to define the pattern.

After developing, I use oxygen plasma to clean the surface, so as to remove
resist residual and active the seed layer.

Hope this can help you.

BR,

YN WANG

> Date: Mon, 9 Aug 2010 12:13:18 -0700
> From: smakhar@ditf.com
> To: mems-talk@memsnet.org
> Subject: [mems-talk] Copper electroplating and Dry film resist
>
> Hello All-
>
> We are pattern plating copper using a negative dry film photoresist. Post
> plating we observe that there is some non-plated area between the dry film
> and the plated area. It seems that this area is not wetted during the
> plating operation. Does anyone know why this would happen? Thanking you.
>
> Regards,
> Sandeep