durusmail: mems-talk: Copper electroplating and Dry film resist
Copper electroplating and Dry film resist
2010-08-09
2010-08-10
2010-08-10
2010-08-10
2010-08-10
2010-08-10
2010-08-10
Copper electroplating and Dry film resist
Denis Petrov
2010-08-10
Hello Sandeep,

what is the size of your structures and the aspect ratio?

Regards,

Denis

PS This is also possible that (as Wang areaday noted) there are resist
residuals on the pattern.

2010/8/10 Yingnan Wang :
> Hello Sandeep,
>
> I had the experience of electro plating Ni using SU-8 to define the pattern.
>
> After developing, I use oxygen plasma to clean the surface, so as to remove
resist residual and active the seed layer.
>
> Hope this can help you.
>
> BR,
>
> YN WANG

--
День

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