Hi Sandeep,

There are several possible reasons for your problem:

1. the non-plated area is still covered by the photoresist, you need to check
your photoresist after development.

2. your substrate pretreatment before photoresist patterning is not good enough
for electroplating.

3. if your pattern is very small, e.g. say less than 50 micron, you probably
need an additional pre-wetting step to make sure the pattern is completely
covered by the electrolyte.

Yingtao

________________________________________
From: mems-talk-bounces+y.tian2=lboro.ac.uk@memsnet.org [mems-talk-
bounces+y.tian2=lboro.ac.uk@memsnet.org] On Behalf Of Sandeep Makhar
[smakhar@ditf.com]
Sent: 09 August 2010 20:13
To: mems-talk@memsnet.org
Subject: [mems-talk] Copper electroplating and Dry film resist

Hello All-

We are pattern plating copper using a negative dry film photoresist. Post
plating we observe that there is some non-plated area between the dry film
and the plated area. It seems that this area is not wetted during the
plating operation. Does anyone know why this would happen? Thanking you.

Regards,
Sandeep