The size the should not be the problem. Try the suggestions from the others. Must work. Good luck! Regards, Denis 2010/8/10 Sandeep Makhar: > Hello All- > > Thanks for all your responses. They have been useful. > > Yingnan- > > I am using AlN substrate with sputtered copper prior to the DF process. I > have tried using oxygen plasma in the past, post development. It seems to > oxidize the copper. Also, on visual inspection the foot of the DFR seemed > unaffected. > > Ningyuan- > > We agree, the problem could be from insufficient rinsing post development.. > We have to address it by rinsing for at least one minute in DI water and > then immerse it in water for about a minute before spray rinsing and drying. > There is not much visible at the foot of the DFR post development. However, > post flood exposure there is a shadow like appearance at the foot of the > resist. We believe could also be causing a problem. I am interested in > trying the two step develop and would share the results. > > Ying-Tao- > > Thanks Ying-Tao. The issues you mention could cause a problem. > > Denis- > > I am using a 3 mil dry film from Eternal, E9230. The feature size is huge.. > These are about 8 to 10 mils. > > Thanks again. Please feel free to to ask if there are any questions or > suggestions. > > Regards, > > Sandeep -- День The Band "Kater Fritz" http://www.myspace.com/thebandkaterfritz