Hi all!

I was wondering if anyone has some kind of input regarding how much better the
adhesion of SU-8 3000 is compared to the 2000 formulation. I'm trying to make a
10- 20 um wide, 5 um high and up to 10 mm long "barrier"on a glass wafer. I did
my first tests with SU-8 2005 this week and noticed that the adhesion was
terrible. Very few of the barriers remained intact and after dicing the wafers
most of them were gone. My wafers were piranha washed and HMDS-treated just
before spinning the SU-8.

I've been reading a bit and people usually recommend making sure that the
exposure time is enough, doing a low temperature PEB, ramping of the hot plates,
having a very clean and dehydrated wafer. Something that also comes up a lot is
to use SU-8 3000 instead as it is supposed to have increased adhesion. My
question is if anyone can comment on how well the 3000 formulation seems to
adhere to glass substrates. I need the structure to remain intact as it will be
a mechanical part of a microfluidic device.

Many thanks and have a great weekend!


/Mikael