Hi ALL,

I was trying to use SOG as release sacrificial layer. However my problem
was SOG at step profile tend to crack due to the shrinkage during curing.
Do you have any experience on this?


Best,
Youmin

On Fri, Jun 5, 2015 at 10:26 AM, Bob Henderson <
bob.henderson@etchedintimeinc.com> wrote:

> Thanks for the tip Shay. I appreciate it. Bob Henderson
>
> -----Original Message-----
> From: mems-talk-bounces+bob.henderson=etchedintimeinc.com@memsnet.org
> [mailto:mems-talk-bounces+bob.henderson=etchedintimeinc.com@memsnet.org]
> On
> Behalf Of Shay
> Sent: Thursday, June 04, 2015 8:33 PM
> To: General MEMS discussion
> Subject: Re: [mems-talk] Spin on Glass applications for MEMS
>
> Bob
>
> SOG can be used for wafer bonding.
>
> Shay
>
>
>
> > On Jun 4, 2015, at 19:01, Bob Henderson
>  wrote:
> >
> > I have recently relocated my equipment business next door to a company
> > that manufactures a variety of spin on glass (SOG) formulations. I am
> > trying to get up to speed on applications that require SOG for various
> > MEMS applications. I understand a Boron SOG can be used as an etch
> > stop in silicon for making membranes but I need to understand if there
> > are other applications SOG is being used for such as to build
> > transistors due to its low temperature applications. Any help would be
> > appreciated. Bob Henderson
> >
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