Hi everyone. For my project, I want to fabricate chips containing microchannels on silicon wafer and I need some ideas for sealing the chip and making a cover on top of it including the inlet/outlet holes.I have a 4 inch silicon wafer and my channels are going to be etched on chips with the dimensions of 25 mm by 15 mm. The channels are 300 micron deep and the surface area of the channel section is smaller than the main chip. I read in different literature that anodic bonding is used to cover the chip with glass. But it seems making the inlet/outlet holes on glass might be tricky. I wanted to know whether it is possible to use PDMS bonding to silicon. Do you think it will seal the chip properly? I'd appreciate any help. Thank you _______________________________________________ Hosted by the MEMS and Nanotechnology Exchange, the country's leading provider of MEMS and Nanotechnology design and fabrication services. Visit us at http://www.mems-exchange.org Want to advertise to this community? See http://www.memsnet.org To unsubscribe: http://mail.mems-exchange.org/mailman/listinfo/mems-talk