On Tue, Jun 9, 2015 at 10:37 PM, André Bödecker
 wrote:
> Hello Leily,
>
> anodic bonding is an expensive, but very reliable process. Structuring of
> glass wafers is not a big problem. You can contact me if you are interested.
>
> Bonding with PDMS normally needs only an oxygen plasma activation of the
> surfaces. There are also some special adhesion promoters if necessary. But a
> tight bonding will only work if the PDMS has a good uniformity and that will
> be a difficulty over a whole 100 mm wafer, I assume. We use the Sylgard 184
> 2k-silicone ("PDMS"; Dow Corning). Even spin-coating leads to an edge bead
> which inhibits a complete contact between two wafers.

How do you get around this? Do you adjust the spin-coating or
viscosity of the resin? Or do you simply cut/dice the bead area away?
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