Hello Leily,
anodic bonding is an expensive, but very reliable process. Structuring of
glass wafers is not a big problem. You can contact me if you are interested.
Bonding with PDMS normally needs only an oxygen plasma activation of the
surfaces. There are also some special adhesion promoters if necessary. But a
tight bonding will only work if the PDMS has a good uniformity and that will
be a difficulty over a whole 100 mm wafer, I assume. We use the Sylgard 184
2k-silicone ("PDMS"; Dow Corning). Even spin-coating leads to an edge bead
which inhibits a complete contact between two wafers.
Regards,
André Bödecker
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Von: mems-talk-bounces+aboedecker=imsas.uni-bremen.de@memsnet.org
[mailto:mems-talk-bounces+aboedecker=imsas.uni-bremen.de@memsnet.org] Im
Auftrag von Leily Majidi
Gesendet: Dienstag, 9. Juni 2015 17:51
An: mems-talk@memsnet.org
Betreff: [mems-talk] PDMS bonding to silicon for micro-channel heat sinks
Hi everyone.
For my project, I want to fabricate chips containing microchannels on
silicon wafer and I need some ideas for sealing the chip and making a cover
on top of it including the inlet/outlet holes.I have a 4 inch silicon wafer
and my channels are going to be etched on chips with the dimensions of 25 mm
by 15 mm. The channels are 300 micron deep and the surface area of the
channel section is smaller than the main chip. I read in different
literature that anodic bonding is used to cover the chip with glass. But it
seems making the inlet/outlet holes on glass might be tricky.
I wanted to know whether it is possible to use PDMS bonding to silicon. Do
you think it will seal the chip properly?
I'd appreciate any help.
Thank you
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