Hello Nathan,

dicing away the area of the edge bead is the only way.

Regards,
André

-----Ursprüngliche Nachricht-----
Von: mems-talk-bounces+aboedecker=imsas.uni-bremen.de@memsnet.org [mailto:mems-
talk-bounces+aboedecker=imsas.uni-bremen.de@memsnet.org] Im Auftrag von Nathan
McCorkle
Gesendet: Mittwoch, 10. Juni 2015 20:29
An: General MEMS discussion
Betreff: Re: [mems-talk] PDMS bonding to silicon for micro-channel heat sinks

On Tue, Jun 9, 2015 at 10:37 PM, André Bödecker 
wrote:
> Hello Leily,
>
> anodic bonding is an expensive, but very reliable process. Structuring
> of glass wafers is not a big problem. You can contact me if you are
interested.
>
> Bonding with PDMS normally needs only an oxygen plasma activation of
> the surfaces. There are also some special adhesion promoters if
> necessary. But a tight bonding will only work if the PDMS has a good
> uniformity and that will be a difficulty over a whole 100 mm wafer, I
> assume. We use the Sylgard 184 2k-silicone ("PDMS"; Dow Corning). Even
> spin-coating leads to an edge bead which inhibits a complete contact between
two wafers.

How do you get around this? Do you adjust the spin-coating or viscosity of the
resin? Or do you simply cut/dice the bead area away?
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