Absolutely repeatable lift off process. Critical dimensions down to 0.08 micron.
Resist thicknesses up to 40 microns so far. Contact
bmoffat@yieldengineering.com.

Sent from my iPad

> On Jul 13, 2015, at 1:10 PM, Joshua Wells  wrote:
>
> I am trying to develop a repeatable liftoff process using LOR10B and an
> 1800 series positive resist for use with 1:1 microdev developer (necessary
> for material compatibility). The trouble arises in the repeatability of the
> process. Time of development varies significantly between runs with no
> process parameters changing yielding far too much undercut for our
> application. We have the LOR thinner and have by trying to work with that
> as well as full thickness LOR.
>
> Does anyone have a repeatable process or suggestions?
>
>
> Joshua
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