durusmail: mems-talk: Liftoff Process Using LOR 10B and 1800 Series Resist
Liftoff Process Using LOR 10B and 1800 Series Resist
2015-07-13
Liftoff Process Using LOR 10B and 1800 Series Resist
Wilson, Thomas
2015-07-17
I've recently developed a bilateral lift off

  *   T. Wilson, K. Korolev K and N. Crowe, "Bilayer lift-off process for
aluminum metallization", Journal of Micro/Nanolithography, MEMS, and MOEMS
(JM3), 14(1), 014501 (Jan-Mar 2015) dx.doi.org/10.1117/1.JMM.14.1.014501.

Sent from my iPhone

On Jul 14, 2015, at 11:59 PM, Bill Moffat
> wrote:

We found the developer concentration and temperature to be important but the
most important factor was the first and second exposure intensity. Bill

Sent from my iPad

On Jul 14, 2015, at 6:33 AM, Andr? B?decker > wrote:

We had also problems while using an automatic developing device. The
undercut depends among other things on the abrasive effect of the spraying
direction of the developer tool. We made better experience with manual
developing in a petri dish and always using fresh developer.

Andr?

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Von: mems-talk-bounces+aboedecker=imsas.uni-bremen.de@memsnet.org
[mailto:mems-talk-bounces+aboedecker=imsas.uni-bremen.de@memsnet.org] Im
Auftrag von Joshua Wells
Gesendet: Freitag, 10. Juli 2015 13:43
An: mems-talk@memsnet.org
Betreff: [mems-talk] Liftoff Process Using LOR 10B and 1800 Series Resist

I am trying to develop a repeatable liftoff process using LOR10B and an
1800 series positive resist for use with 1:1 microdev developer (necessary
for material compatibility). The trouble arises in the repeatability of the
process. Time of development varies significantly between runs with no
process parameters changing yielding far too much undercut for our
application. We have the LOR thinner and have by trying to work with that as
well as full thickness LOR.

Does anyone have a repeatable process or suggestions?


Joshua
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