We had also problems while using an automatic developing device. The undercut depends among other things on the abrasive effect of the spraying direction of the developer tool. We made better experience with manual developing in a petri dish and always using fresh developer. André -----Ursprüngliche Nachricht----- Von: mems-talk-bounces+aboedecker=imsas.uni-bremen.de@memsnet.org [mailto:mems-talk-bounces+aboedecker=imsas.uni-bremen.de@memsnet.org] Im Auftrag von Joshua Wells Gesendet: Freitag, 10. Juli 2015 13:43 An: mems-talk@memsnet.org Betreff: [mems-talk] Liftoff Process Using LOR 10B and 1800 Series Resist I am trying to develop a repeatable liftoff process using LOR10B and an 1800 series positive resist for use with 1:1 microdev developer (necessary for material compatibility). The trouble arises in the repeatability of the process. Time of development varies significantly between runs with no process parameters changing yielding far too much undercut for our application. We have the LOR thinner and have by trying to work with that as well as full thickness LOR. Does anyone have a repeatable process or suggestions? Joshua _______________________________________________ Hosted by the MEMS and Nanotechnology Exchange, the country's leading provider of MEMS and Nanotechnology design and fabrication services. Visit us at http://www.mems-exchange.org Want to advertise to this community? See http://www.memsnet.org To unsubscribe: http://mail.mems-exchange.org/mailman/listinfo/mems-talk _______________________________________________ Hosted by the MEMS and Nanotechnology Exchange, the country's leading provider of MEMS and Nanotechnology design and fabrication services. Visit us at http://www.mems-exchange.org Want to advertise to this community? See http://www.memsnet.org To unsubscribe: http://mail.mems-exchange.org/mailman/listinfo/mems-talk