Thanks to your emails. I have some Cr/Au cantilevers anchored to substrate, the sacrificial layer is a very thin layer of photo-resist(HPR504) . They are pretty wide and large cantilevers (200*400 um). I am afraid that any wet etch (even followed by critical dry point) would result in sticking problems. Dry etch is also usually directional so I may not get rid of the resist completely. ________________________________ From: Prasanna SrinivasanTo: General MEMS discussion Sent: Sat, September 18, 2010 9:11:52 AM Subject: Re: [mems-talk] releasing cantilever beams without release holes Hello Nahid, I released cantilever and bridge structures of Al-Si3N4 from the silicon substrate by isotropic plasma etch. There were no etch holes in those structures. However, I experienced large undercut on the structures which was fine for my application. Can you provide more information what exactly you are looking for? What materials you are processing? Regards, Prasanna