you need to purify the electrolyte (by filtering) before plating.
you need to finely optimize the current density, plating time, rotation
speed, temperature etc.

--JVN SHARMA
MEMS & MICROSENSORS,
CEERI, PILANI (INDIA).

On Wed, Mar 9, 2011 at 4:49 AM, Sheng Zhang  wrote:

> Hi, All,
>
> I'm having trouble electroplating Au onto Cr/Au (15nm/55nm) seed layer
> on quartz substrate. I used lift off process to pattern the metal, and
> the patterns are fine after lift off. But when electroplating, the
> pattern comes off (in one piece, so definitely an adhesion problem).
> Does the electroplating solution or temperature affect adhesion?
>
> Any advice would be greatly appreciated!
>
> Thanks!